TitleProduct

10M04DAU324C8G

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Guangdong

  • Validity to:

    Long-term effective

  • Last update:

    2023-12-05 12:45

  • Browse the number:

    289

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Company Profile

Xianneng Technology(Hk)International Ltd

By certification [File Integrity]

Contact:xiannwy(Mr.)  

Email:

Telephone:

Phone:

Area:Guangdong

Address:Guangdong

Website:http://www.xiannengic.com/ http://xiannwy.cinv-intr.com/

PRODUCT DETAILS




















































Series



MAX® 10



Package



Tray



Product Status



Active



Number of LABs/CLBs



250



Number of Logic Elements/Cells



4000



Total RAM Bits



193536



Number of I/O



246



Voltage - Supply



1.15V ~ 1.25V



Mounting Type



Surface Mount



Operating Temperature



0°C ~ 85°C (TJ)



Package / Case



324-LFBGA



Supplier Device Package



324-UBGA (15x15)




 





Feature


 




Description



Technology



55 nm TSMC Embedded Flash (Flash + SRAM) process technology



 



Packaging



• Low cost, small form factor packages-support multiple packaging



technologies and pin pitches



• Multiple device densities with compatible package footprints for seamless



migration between different device densities



• RoHS6-compliant



 



Core architecture



• 4-input look-up table (LUT) and single register logic element (LE)



• LEs arranged in logic array block (LAB)



• Embedded RAM and user flash memory



• Clocks and PLLs



• Embedded multiplier blocks



• General purpose I/Os



 



Internal memory blocks



• M9K-9 kilobits (Kb) memory blocks



• Cascadable blocks to create RAM, dual port, and FIFO functions



 



User flash memory (UFM)



• User accessible non-volatile storage



• High speed operating frequency



• Large memory size



• High data retention



• Multiple interface option



 



Embedded multiplier blocks



• One 18 × 18 or two 9 × 9 multiplier modes



• Cascadable blocks enabling creation of filters, arithmetic functions, and image



processing pipelines



 



ADC



• 12-bit successive approximation register (SAR) type



• Up to 17 analog inputs



• Cumulative speed up to 1 million samples per second ( MSPS)



• Integrated temperature sensing capability



Clock networks



• Global clocks support



• High speed frequency in clock network



Internal oscillator



Built-in internal ring oscillator



 



PLLs



• Analog-based



• Low jitter



• High precision clock synthesis



• Clock delay compensation



• Zero delay buffering



• Multiple output taps



General-purpose I/Os (GPIOs)



• Multiple I/O standards support



• On-chip termination (OCT)



• Up to 720 megabits per second (Mbps) LVDS receiver and transmitter



External memory interface (EMIF) (1)



Supports up to 600 Mbps external memory interfaces:



• DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)



• SRAM (Hardware support only)



 





Payment Method & Shipping


 




PAYMENT TERMS





 



● We accept PayPal, Trade Assurance, MonryGram, Western Union and Bank T/T



● FOB price, not including shipping cost and trading charges.

● The buyers should be responsible for the trading charges.



 



SHIPPING TERMS





● We will pack and send your goods within 1-3 working days after we confirmed your payment.

● We will inform you the lead time if we have to purchase from manufactory.



● We usually ship by DHL, EMS , UPS, TNT, FedEx, or Aramex . It usually takes 3-5 days to arrive.China Post smallpacket and sea shipping are aslo optional,But the time is slow, suitable for samples and large quantities of goods.

● We are not responsible for any accidents, delays or other situations related with shipping company. But we will keep focus on the package tracking.

● Tracking number will be shared with you when we got it from the logistics company.



 

http://www.xiannengic.com/